It is high, but it probably can sustain much higher all core frequency compared to 7950x3D (or 7950x). If nothing else, it has a bigger die and heat spreading to pull heat from, it should be easier to maintain thermal headroom on the EYPC chip.
That being said, it looks most probable what a 9175F is just a 9755 (their absolute max full size Zen5 core part) with nearly all (7/8) of their cores per CCD disabled in order to get all 512MB of cache. This means that there's a lot of extra interconnect being kept running per core which certainly would contribute to the higher TDP.
Of course, in principle this should also mean that each core (which should basically have all of a CDD's IO and cache available to it) should be screaming fast in real terms.
Of course finally, TDP is a totally fluffy number. The TDP of the 7950X3D is most probably as low as it is because of how much internal thermal resistance (the extra V-Cache layer) it has. Part of it's lower TDP isn't because "it's efficient", part of it is because "if we run it hotter, we'll melt it". The TDP for the 7950X for example is 170W.
That being said, it looks most probable what a 9175F is just a 9755 (their absolute max full size Zen5 core part) with nearly all (7/8) of their cores per CCD disabled in order to get all 512MB of cache. This means that there's a lot of extra interconnect being kept running per core which certainly would contribute to the higher TDP.
Of course, in principle this should also mean that each core (which should basically have all of a CDD's IO and cache available to it) should be screaming fast in real terms.
Of course finally, TDP is a totally fluffy number. The TDP of the 7950X3D is most probably as low as it is because of how much internal thermal resistance (the extra V-Cache layer) it has. Part of it's lower TDP isn't because "it's efficient", part of it is because "if we run it hotter, we'll melt it". The TDP for the 7950X for example is 170W.