Nvidia and really all chip designers are limited by the fab companies who are trying to scale as fast as they can. But all the cutting edge fabs are limited by one single supplier - ASML. ASML make the lithography machines and have a total monopoly. Even they cannot make lithography machines fast enough to satisfy demand - their lithography machines are sold out 2 years in advance
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CoWoS stands for Chip on Wafer on Substrate. It is a high-density packaging technology for high-performance chips. TSMC developed CoWoS in 2012.
In CoWoS, multiple silicon dies are placed on a silicon interposer, which is an intermediate layer on the package board.
The interposer acts as a communication layer for the active die on top. CoWoS is a 2.5D packaging technology. It is widely used in high performance computing.
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