>We’ve seen that Samsung’s 5LPE node used by Qualcomm and S.LSI in the Snapdragon 888 and Exynos 2100 has under-delivered in terms of performance and power efficiency, and I generally consider both big cores' power consumption to be at a higher bound limit when it comes to thermals.
I expect Qualcomm to stick with Samsung foundry in the next generation, so I am admittedly pessimistic in regards to power improvements in whichever node the next flagship SoCs come in (be it 5LPP or 4LPP). It could well be plausible that we wouldn’t see the full +16% improvement in actual SoCs next year.
Honestly, they're probably stuck with Samsung for the mid term (5 years). You simply can't get any TSMC capacity on their top nodes when Apple and AMD get first and second bid on everything. Maybe GloFo will figure out their issues, and maybe Intel will sell their latest nodes, but until then companies are stuck with their current partners.
Didn't gloflo officially announce they will stick to >14nm a few years ago? Have they started developing a new node? IIRC they just didn't have the capital to keep churning out a few dozens of billions on r&d/equipment every few years, so they shifted their focus on maximizing yield on older nodes
I expect Qualcomm to stick with Samsung foundry in the next generation, so I am admittedly pessimistic in regards to power improvements in whichever node the next flagship SoCs come in (be it 5LPP or 4LPP). It could well be plausible that we wouldn’t see the full +16% improvement in actual SoCs next year.
https://www.anandtech.com/show/16693/arm-announces-mobile-ar...
It sounds like the thermal issues of the current generation flagship Android chips are expected to remain in place.