Interesting heat dissipation challenges with vertically stacked CPU's. I wonder if there would be advantages to stacking alternating layers of CPU core, DRAM, CPU, DRAM...
For cooling purposes, is it feasible to put a solid-state Peltier cooler integrated onto the die? The first thing that comes to mind is the energy costs but I would think that it would be less than sending current through a fan motor.
For cooling purposes, is it feasible to put a solid-state Peltier cooler integrated onto the die? The first thing that comes to mind is the energy costs but I would think that it would be less than sending current through a fan motor.