On: ROCm Device Support Wishlist

[jorvi]

3D-Cache blows Intel out of the water and has absolutely nothing to do with TSMC. Same goes for the clever chiplet design.

[modeless → jorvi]

This is false. 3D VCache is enabled by TSMC's 3DFabric packaging. It also didn't really play a role in AMD passing Intel. Chiplets are also enabled by TSMC technology, CoWoS.

[jorvi → modeless]

> 3D VCache is enabled by TSMC's 3DFabric packaging

> Chiplets are also enabled by TSMC technology, CoWoS.

Interesting, my mistake. Thank you for pointing that out!

[wmf → modeless]

But AMD decided to use those technologies and Intel decided not to. AMD on TSMC N4 is beating Intel on TSMC N3 because AMD has better designs.

[modeless → wmf]

When AMD passed Intel, they hadn't even decided to use TSMC at all yet. Of course now Intel is behind in leveraging TSMC technology. They started late.