Will be interesting when chiplet technology gets to the point where multiple chips are installed in a plastic package (there are thermal expansion/contraction issues that make this a hard problem but still ...)
If and when the cooling problem is solved and we can just stack layers at will computronium will truly have arrived. Adding another dimension will unlock hardware potential that we can only dream of today.
Will be interesting when chiplet technology gets to the point where multiple chips are installed in a plastic package (there are thermal expansion/contraction issues that make this a hard problem but still ...)