Core chiplets only send signal to I/O die, the distance is measured in mm and the parameters of these wires is tightly controlled by AMD.
I/O die sends signals to the rest of hardware. Wires are way longer, often with multiple connectors in them. I/O chiplet needs to produce and consume more of these milli-amps of electrical current.
One can produce larger transistors with finer processes e.g. by adding more fins to FinFETs, but since they need larger transistors anyway to handle more current, I’m not sure there’s much value in upgrading process of the I/O chiplet.
I/O die sends signals to the rest of hardware. Wires are way longer, often with multiple connectors in them. I/O chiplet needs to produce and consume more of these milli-amps of electrical current.
One can produce larger transistors with finer processes e.g. by adding more fins to FinFETs, but since they need larger transistors anyway to handle more current, I’m not sure there’s much value in upgrading process of the I/O chiplet.