Well, maybe. Probably so, in part, but intel makes large dies rather than AMD's style of multiple smaller dies, which means signals have less far to go (and possibly don't have to be boosted to get between mini-dies).
Perhaps someone who knows about this stuff can comment.
Edit: the mini-dies are chiplets/CCDs. Couldn't remember the name.
As I understood, they had to much hick-ups going to smaller dies because of internal issues.
They plan to recover in the end of 2020, while temporarily leaving the market open for AMD. Accepting that made them willing to fix their security issues, which decrease performance.
Since they have no product line in response to AMD for now, that was not an easy call for sure.
Perhaps someone who knows about this stuff can comment.
Edit: the mini-dies are chiplets/CCDs. Couldn't remember the name.